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application/pdfIEEEJournal of Microelectromechanical Systems;2020;29;5;10.1109/JMEMS.2020.3022050MEMSmicroresonatorsthermal-piezoresistive pumpingthermal conductivityelastic modulusLimits to Thermal-Piezoresistive Cooling in Silicon Micromechanical Resonators
Journal of Microelectromechanical Systems677 Oct. 202052910.1109/JMEMS.2020.3022050684
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